15th IC Packaging Technology Expo
date:2014-01-15~2015-01-17
city:Tokyo
address:Tokyo Big Sight, Tokyo, JAPAN
hallname:Tokyo Big Sight
sponsor:Reed Exhibitions Japan Ltd.
contact details
name:Hajime Suzuki (Mr.)
telephone:+81-3-3349-8518
fax:+81-3-3349-8530
Email:inw@reedexpo.co.jp
details info



What is ICP?

Gathers wide variety of Packaging Technologies for IC Devices!

All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here. ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.






Visitor Profile
Professionals of semiconductor assembly electronics ma

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