RF4 0.3-1.0mm Sn63% Rosin Core Tin Solder Wire For Phone BGA Repair
date:Oct 17, 2023
price:6.00/piece
model:Iron Tips & Nozzles
standard:shenzhen
brand:T/TL/CD/P D/ACredit CardPayPalCashEscrow
minamount:1piece
amount:1000000piece
Delivery time:7days
contact
company:Shenzhen PHONEFIX technology Co.,Ltd
send:click send
name:7180 phonefix(Mr.)
telephone:1336042718
mobile:1336042718
adress:JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District
post code:518116
Email:phonefix7180@gmail.com
Details

RF4 RF-106A 0.6mm 108A RF-0.8mm 100g / RF-203D 0.3mm RF-204D 0.4mm RF-206D 0.6mm RF-208D 0.8mm RF-210D 1.0mm 200g Sn63% Lead-Free Rosin Core Solder Tin Wire. RF4 BGA desoldering wire for mobile phone motherboard SMD PCB welding repair tool.

Features:

Environmentally friendly and lead-free.
Good wettability, conductivity, and resistance to heat fatigue.
The solder joint is smooth and it can effectively resist oxidation.
Fast spreading speed even with small holes.
The solder
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