MECHANIC Sn63% Pb37% Rosin Core Tin Solder Wire For Phone BGA Repair
m (50g)
Option 2: 0.5mm (50g)
Option 3: 0.6mm (50g)
Option 4: 0.8mm (50g)


Features :

Good solder-ability, insulation resistance, no spattering and non-corrosive.
With a low melting point, usually used in iron soldering with bright and full soldering points for phone circuit board repair.
Features with anti-oxidation stability and anti-corrosion ability, it has excellent performance in desoldering.
It is affordable and convenient to operate.
It is widely used in
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04/21 02:01