date:Aug 25, 2023
price:6.00/piece
model:BGA Reballing Platform
standard:shenzhen
brand:T/TL/CD/P D/ACredit CardPayPalCashEscrow
minamount:1piece
amount:1000000piece
Delivery time:7days
contact
company:Shenzhen PHONEFIX technology Co.,Ltd
send:click send
name:7180 phonefix(Mr.)
telephone:1336042718
mobile:1336042718
adress:JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District
post code:518116
Email:phonefix7180@gmail.com
Details
WL High-Quality Universal Repair Holder for CPU NAND Baseband Tin Plate Steel Net BGA Reballing Stencil Positioning Mold with Fixed Plate.
Descripion:
WL BGA Reballing Stencil Positioning Mold for WL BGA Reballing Stencil
Universal Aluminum Mould Base for WL 0.1mm BGA Reballing Stencil
Magnetic cell phone BGA reballing stencil positioning mold for BGA Chip repair
Compatible with: iPhone 5 5C 5S 6 6S 6P 6SP 7 7P / A6 A7 A8 A9 A10
Package included:
1pc x Holder