date:Aug 24, 2023
price:19.00/piece
model:BGA Reballing Platform
standard:shenzhen
brand:T/TL/CD/P D/ACredit CardPayPalCashEscrow
minamount:1piece
amount:1000000piece
Delivery time:7days
contact
company:Shenzhen PHONEFIX technology Co.,Ltd
send:click send
name:7180 phonefix(Mr.)
telephone:1336042718
mobile:1336042718
adress:JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District
post code:518116
Email:phonefix7180@gmail.com
Details
QianLi ToolPlus iP-01 iP-02 Middle layer fram BGA reballing stencil platform for iPhone X XS XS MAX 11 Pro MAX motherboard repair, ToolPlus iP-01 iP-02 iPhone middle layer planting tin soldering fixture, Qianli 3D BGA reballing metl stencil motherboard middle fram planting tin reballing platform for iPhone logic board repair net fixture
QianLi ToolPlus iP-01 iP-02 BGA Reballing Platform for iPhone X-11 Pro Max Logic Board Dissembling and Assembling Testing Tool
[ Optional BGA Platform ] :