date:Aug 10, 2023
price:15.00/piece
model:BGA Reballing Platform
standard:shenzhen
brand:T/TL/CD/P D/ACredit CardPayPalCashEscrow
minamount:1piece
amount:1000000piece
Delivery time:7days
contact
company:Shenzhen PHONEFIX technology Co.,Ltd
send:click send
name:7180 phonefix(Mr.)
telephone:1336042718
mobile:1336042718
adress:JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District
post code:518116
Email:phonefix7180@gmail.com
Details
MIJING Z21 MAX chip tin station CPU reballing stencil platform for iPhone 6-14 Pro Max A8-A16 CPU, Android Phones. MJ Z21 MAX CPU IC tin planting platform with stell mesh for iPhone Android CPU repair. MIJING Z21 MAX CPU reballing stencil platform for iPhone A8 A9 A10 A11 A12 A13 A14 A15 A16 CPU, Android Huawei Qualcomm,ect.
Applicable Model:
1. For iPhone 6-14 Pro Max CPU (A8 A9 A10 A11 A12 A13 A14 A15 A16 CPU).
2. For Huawei HI3670, Huawei HI3680, HiSilicon HI3690, HiSilicon HI3690 5G, HiSili