date:Aug 07, 2023
price:12.00/piece
model:BGA Reballing Platform
standard:shenzhen
brand:T/TL/CD/P D/ACredit CardPayPalCashEscrow
minamount:1piece
amount:1000000piece
Delivery time:7days
contact
company:Shenzhen PHONEFIX technology Co.,Ltd
send:click send
name:7180 phonefix(Mr.)
telephone:1336042718
mobile:1336042718
adress:JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District
post code:518116
Email:phonefix7180@gmail.com
Details
MiJing M21 universal magnetic base mobile phone motherboard middle layer fram reballing platform. MiJing universal magnetic base with magnetic steel mesh stencil and scraper blade tin paste knife for cell phone logic board middle layer mid fram BGA Tin planting repair.
Mijing GX01 GX02 Non-magnetic tin paste scraper knife set for motherboard IC glue removing tin-planting.
Features:
1. Temperature resistance and strong magnetism.
2. Temperature-resistant silicone material, built-in strong magne