16th IC PACKAGING TECHNOLOGY EXPO
date:2015-01-14~2015-01-16
tion Equipment
Surface Processing Technology/Related Products, etc.
MEMS Packging Zone
3D Integration, 3D Packaging Technologies for MEMS Devices Gather!
[MEMS Device Manufacturing Equipment]
Dicing Machines
Die Bonders
Wire Bonders
Flipchip Bonders
Microchip Bonders etc.
[Molding Machines]
Welding Machines
Fine Processing Equipment
Drilling Machines
Plating Equipment
Coating Machines
Sputtering System
Exposure Equipment
Vacuum Equipment
Bonding Equipment
Heat Press Machines
Imprinting Systems

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