date:2015-01-14~2015-01-16
nts
Sealant (Mold Materials)/Under-fill Materials
ACF/NCF, ACP/NCP
Die Adhesives
Lead Frames
Bonding Wires
Tape Materials
Soldering Balls/Materials
Bump Materials
Packaging Substrates
(PCBs, Tape Substrates, Ceramic Substrates, etc.)
Other Materials/Components
Analysis/Simulation Software for IC Packaging
Analysis Services/Software
Simulation Software
Various Software, etc.
Various Packages
CSP
BGA
Wafer Level CSP
MCM, etc.
Semiconductor Device Inspection Testing Zone
Specialised in Inspectio