16th IC PACKAGING TECHNOLOGY EXPO
date:2015-01-14~2015-01-16
ign, RD, Quality Control, Purchasing, etc.
Visitors are from:
Semiconductor Manufacturers
Assembly Manufacturers/SATS
Sensor Manufacturers
Set Manufacturers (in high-density SMT)
MEMS Devices/LED Manufacturers
Automotive Electronics Manufacturers
Exhibit Profile
Assembly Equipment
Wire Bonders
Die Bonders
FC Bonders
Other Various Bonders
Molding Machines
Resin Coating Machines
Dicing Machines
Lead Processing Machines
Laser Processors
Other Equipment for IC Packaging

Packaging Materials/Compone

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