16th IC PACKAGING TECHNOLOGY EXPO
date:2015-01-14~2015-01-16
INTERNEPCON JAPAN
32nd ELECTROTEST JAPAN
16th ELECTRONIC COMPONENTS MATERIALS EXPO
PWB EXPO16th Printed Wiring Boards Expo
5th FINE PROCESS TECHNOLOGY EXPO
Concurrent Shows of NEPCON JAPAN 2015 44th Electronics RD and Manufacturing Technology Expo

[NEW]1st WEARABLE EXPO - Wearable Device Technology Expo
AUTOMOTIVE WORLD 2015
LIGHTING JAPAN 2015
Visitor Profile
Professionals of semiconductor assembly electronics manufacturers in fields such as:
Production/Manufacturing, Engineering, SMT, Des

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