date:2015-01-14~2015-01-16
city:Tokyo
address: Tokyo Big Sight , Japan
hallname:Tokyo Big Sight
sponsor:Reed Exhibitions Japan Ltd.
contact details
name:Hajime Suzuki (Mr.), Taikoku K
telephone:+81-3-3349-8519
details info
Dates: January 14 [Wed] - 16 [Fri], 2015
Venue: Tokyo Big Sight, Tokyo, JAPAN
Organised by: Reed Exhibitions Japan Ltd.
Exhibition Title: 16th IC PACKAGING TECHNOLOGY EXPO
Concurrent Event:
IC PACKAGING TECHNOLOGY EXPO Technical Conference
Special Exhibit Zones:
Semiconductor Device Inspection Testing Zone
SATS/Contract Design Services Zone
Plating/Etching Zone
MEMS Packaging Zone
Concurrent Shows held inside NEPCON JAPAN 2015 44th Electronics RD and Manufacturing Technology Expo
44th